台湾
30000
1+ ¥0.10
10000
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供应SD卡座连接器 SD卡座垫高1.8 外焊SD卡座垫高1.8 外焊 优势
卡座
MATERIAL:Insulator:LCP/ThermalPlastic,UL94V-0Contacts:PhosphorBronze/CopperAlloyShell:StainlessSteelGrounding:BrassCONTACTPLATING:Underplate:50μ”~100μ”NickelContactArea:1μ”~30μ”SelectiveGoldSolderTailsArea:100μ”Tin/Lead(BrightenTin)or100μ”~200μ”Tin/LeadFree(BrightenTin/MatteTin)ELECTRICAL:OperationVoltage:3.3VACMax.CurrentRating:0.5AContactResistance:1000OHMSMax.InsulationResistance:1000ohmsmin@500VDC.DielectricWithstandingVoltage:1000VAC/minuteOperatingTemperature:-20°Cto+85°CMatingCycles:10000Cycles,Springisnotbreaking
5000
1+ 面议
50000
1+ 面议
供应SIM卡座连接器 SIM 卡座 翻盖式8PINSIM 卡座 翻盖式8PIN 优势
卡座
1.MECHANICAL:MATINGCYCLES:5000INSERTIONS.2.ELECTRICAL:CURRENT:0.5AVOLTAGE:5.0VRMSCURRENTRATING:1A,30VACWITHSTANDINGVOLTAGE:250VACCONTACTRESISTANCE:100mΩMAXINSULATIONRESISTANCE:500MΩMIN3.ENVIRONMENTAL:TEMPERATURERANGE:-55℃~85℃
500000
1+ 面议
卡座
Specification:WithstandingVoltage:500VACMaxfor1MinuteInsulationResistance:1000MΩVoltageRating:100VACCurrentRating:0.5AAC/DCMaxContactResistance:40MΩMaxInsertionCycles:1000TimesApplication:ForCompactFlashTypeIAndTypeIICardUseMaterial:1Insulator:ThermalPlasticUL94V-02Contact:CopperAlloy3ContactPlatingUnderplate:50u''-100u''NickelContactArea:5u''-30u''SelectiveGoldSolderTailsArea:100u''-200u''Tin/LeadFree(BrightenTin/MatteTin)
500000
1+ 面议
500000
1+ 面议
5000
1+ 面议
50000
1+ 面议
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